Capabilities
Die Prep
Wafer thinning
Wafer dicing
Pick and Place
Die Inspection
Packaging & Assembly
SiP/MCM
Die attach
Standard IC Packages
Flip Chip Interconnect
Encapsulation
Quick Turn
Electrical Test
Total Test
Device Upscreen
Wafer Probe
Singulated Die Probe
FPGA
Custom ASIC/FPGA
Reliability & Qualification
PEM Qualification
Cu Wire Evaluation
ESD Services
Other
DPA & FA
Laser ablation
DPA
FA
Other
Counterfeit Detection
Other Services
Obsolescence Management
BOM Management
Parts Management Program
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