Integra offers a complete suite of singulated die probing and testing services!

Bare die testing is essential for optimizing yields in the following applications:

  • singulated-die-probeMulti-Chip Modules
  • System in Package
  • Die Reclamation and Repackaging
  • Hybrid Microcircuits

Integra die probing and testing capabilities include:

  • Die pad-counts from 2 to 8,000+
  • Temperatures from -55ºC to +125ºC
  • Device complexities from simple discretes to complex FPGAs & Microprocessors
  • Device speeds of 40GHz+
  • Minimal probe marks on pad
  • Precise micro manipulation for X, Y, Z and θ adjustment