Die Prep
Wafer Thinning & Polishing
Wafer Dicing
Die Pick & Place
Die Inspection
Packaging &
Assembly
Die Attach
Standard IC Packages
Interconnect
Encapsulation
Package Assembly Capabilities Chart
Advanced Packaging &
Assembly
SiP/MCM
BOM Procurement
Program Management
Electrical Test
Total Test Solution
Device Up Screening
Wafer Probe
Reliability &
Qualification
PEM Qualification
Cu Wire Evaluation
Additional Services
DPA & FA
Laser Ablation
Destructive Physical Analysis
Failure Analysis
Additional Services
Integra BLOG
Integra Technologies is the answer to your IC assembly and Test subcontracting needs!
SERVICES:
Die Prep
Packaging & Assembly
Advanced Packaging & Assembly
Electrical Test
Reliability & Qualification
Destructive Physical Analysis
Failure Analysis
Contact us today
for more information on one or more of these services! We look forward to hearing from you.
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