wafer_probeIntegra Technologies has the engineering talent, equipment and processes in place to support all wafer probe services, including test software development, probe card design/fabrication, debug and production probing.

Experience with all probe card technologies including:

  • Cantilever: 1- 16 sites up to 800 probes
  • Vertical: Multi site up to 64 sites
  • Membrane: Multi site
  • MEMS probe cards
  • RF probe to 40 GHz and higher
  • Wafer probing -55°C to +125°C
  • Elevated probing up to 180°C
  • Singulated die probe, -55°C to +125°C, pin count to 8000+ pads
  • Bumped or unbumped wafer probe

Wafer probe data analysis throughout your startup and ongoing production probe:

  • Wafer Map Conversion
  • Retest of defined bins without full wafer reprobe
  • Custom mapping for inkless assembly
    • Onsite custom format solutions for inkless assembly
    • Assembly back to production map conversion
    • Wafer inspection map conversion to electrical test maps
  • Wafer Analysis
    • Composite Mapping
    • Multi site comparison
    • Integration to Galaxy® software

Summary of Probe Capabilities:

  • Known Good Die (KGD)
  • Wafer Level/Chip Scale Packaging (WLP or CSP)
  • Bumped or copper pillar wafers
  • Tight pitch aluminum or gold pads
  • Thin wafers
  • Digital, Mixed Signal and RF probe
  • 2” to 12” wafer capability
  • Probe card design, fab and verification
  • Al, Au pads and Pb, Pb free bumps
  • High Z force chuck
  • High pin count, fine pitch
  • Multi site
  • RF probe (Membrane, Coax or custom solutions)
  • N2 and vacuum wafer storage
  • Data analysis capability
  • High volume production probe
  • 5 mil thick wafers
  • 20+ years of wafer probe experience
  • 100 million plus die probed
  • 24x7 production capability
  • 25+ test engineers