ASSEMBLY SERVICE GUIDE

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September 2024

Discover how to optimize your product's cost-efficiency and manufacturability with insights from this comprehensive guide!

In the 2024 edition, we've incorporated new equipment and refined processes to enhance your product's efficiency. This guide includes:

- Wafer Thinning/Individual Die Thinning
- Laser Grooving, Dicing, DBG
- Die Pick-n-Place
- Automated & Manual Visual Inspection
- Tape and Reel of Die
- Wafer Laser Marking
- Die Attach
- SET-NA Precision Bonding
- Die to Wafer Direct Bonding
- Cavity Package Rules
- Flip Chip Assembly
- Stud Bump Guidelines
- Wire Bond Guidelines
- Ribbon Bonding
- Corner Pad Design Rules
- Chip-On-Board (COB) Assembly
- Dam-n-Fill
- Mold Systems
- QFN Guidelines
- Mold Strip Dimensions
- Map BGA Guide
- Package Laser Mark
- Seam Seal Guide
- SiPho Fiber Connection
- Shipping Media
- Enhanced Handling

This guide is provided to assist you in making your products more manufacturable and thus assist in achieving maximum yields.

Fill out the form and receive a copy of the 'General Guide For Assembly Services' PDF. Please let us know if you have any questions or Request a Quote today!

 

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