DOWNLOAD YOUR UPDATED GUIDE TODAY
September 2024
Discover how to optimize your product's cost-efficiency and manufacturability with insights from this comprehensive guide!
In the 2024 edition, we've incorporated new equipment and refined processes to enhance your product's efficiency. This guide includes:
- Wafer Thinning/Individual Die Thinning |
- Laser Grooving, Dicing, DBG |
- Die Pick-n-Place |
- Automated & Manual Visual Inspection |
- Tape and Reel of Die |
- Wafer Laser Marking |
- Die Attach |
- SET-NA Precision Bonding |
- Die to Wafer Direct Bonding |
- Cavity Package Rules |
- Flip Chip Assembly |
- Stud Bump Guidelines |
- Wire Bond Guidelines |
- Ribbon Bonding |
- Corner Pad Design Rules |
- Chip-On-Board (COB) Assembly |
- Dam-n-Fill |
- Mold Systems |
- QFN Guidelines |
- Mold Strip Dimensions |
- Map BGA Guide |
- Package Laser Mark |
- Seam Seal Guide |
- SiPho Fiber Connection |
- Shipping Media |
- Enhanced Handling |
This guide is provided to assist you in making your products more manufacturable and thus assist in achieving maximum yields.
Fill out the form and receive a copy of the 'General Guide For Assembly Services' PDF. Please let us know if you have any questions or Request a Quote today!