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Integra is at IMAPS Boston NOW!

Posted by Susan Campbell on Wed, Oct 02, 2019 @ 09:35 AM

imaps-boston-2019Stop by booth #401 at IMAPS Boston today and tomorrow and say Hi to John and Richard.

They are eager to discuss Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Visit Us at the IMAPS Advanced System in Package Technology Conference and Exhibition June 25-27

Posted by Susan Campbell on Thu, Jun 20, 2019 @ 10:42 AM
 

Integra's System-in-Package & MCM solutions offer the capabilities of a complete system in one device. As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. Our SiP solutions can help product developers achieve next-generation performance levels. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power (SWaP) that are critical to next-generation performance in defense and medical applications.

Stop by the IMAPS Advanced System in Package (SiP) Technology Conference and Exhibition, Tues-Thurs, June 25-27 and talk to us more on how we can help with your SiP needs! 

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