Take a look at some of our most frequently asked questions:
Q: What are Integra's NEW bonding capabilities?
A: Integra Technologies recently added a FC150 Automated Die/Flip Chip Bonder to its line up at their Milpitas, CA location.
Q: What materials does the FC150?
A: The FC150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe allowing easily changed bond processes.
Q: What are some of the benefits of the FC150?
A: Some of the benefits include:
Q: What is the FC150 application range?
A: Chip-to-Chip, Chip-to-Substrate Bonding, Chip Stacking, 3D Interconnect, Optical Components and Photonics Device Packaging, MOEMS, MEMS, MCM, and Nanoimprint Lithography
Q: What are some of the FC150 capabilities?
A: Capabilities include:
Find out more by downloading the General Guide for Assembly Services
Have more questions? Let us know: sales_inquiry@integra-tech.com