Take a look at some of our most frequently asked questions:
A: Essentially, the name “Flip Chip” describes the method used to connect a semiconductor die to a substrate: The dies are bumped and then “flipped” onto a substrate, hence the name “Flip Chip”.
Q: What are the typical benefits of a Flip Chip device vs. a wire bonded device?
A: Flip Chip package technology offer a range of benefits including:
Q: What is a Flip Chip substrate?
A: Flip Chip substrate is in essence a small Printed Circuit Board (PCB) located inside the package.
Q: What are the Assembly Steps of a Flip Chip Device?
A: In order for the chip to be connected or mounted to a substrate, the die is turned or flipped over and brought into alignment with the pads located on the substrate. There are six (6) key process steps: Fluxing, Placement, Reflow, Flux Cleaning, Capillary Underfill, and Cure.
Q: What are some of your Assembly Guidelines for Flip Chip Devices?