Q: What does Die Prep Encompass?
Q: What is wafer backgrind?
A: Wafer thinning, or backgrind, is the process of removing material from the backside of a wafer to a desired final target thickness
Q: What are the most common forms of backgrind?
A: The most common methods of wafer thinning are mechanical grind, wet etch, and chemical-mechanical planarization (CMP)
Q: What kind of backgrind does Integra use?
A: Mechanical grind
Q: What does microgrind or polish do to my wafer?
A: Die strength and smoothness can be increased based on grit/slurry selection (increasing smoothness), while also decreasing warpage and subsurface damage
A: The most common methods of wafer singulation are mechanical dicing, laser dicing, scribe and break, and dice before grind (DBG)
Q: What determines the best method for wafer singulation of my wafer?
A: Material type, wafer thickness, and street width are the most critical factors in wafer singulation when determining the optimal process method
Q: What are some keys when considering street widths of my wafer and subsequent dicing?
A: The following are keys when considering Street Width
Q: I have a multi-project wafer, what are some considerations?
A: The following are considerations