What does die prep encompass?
Wafer thinning, or backgrind, is the process of removing material from the backside of a wafer to a desired final target thickness.
What are the most common forms of backgrind?
The most common methods of wafer thinning are:
What kind of backgrind does Integra use?
Mechanical grind
What does microgrind or polish do to the wafer?
Die strength and smoothness can be increased based on grit/slurry selection (increasing smoothness), while also decreasing warpage and subsurface damage.
What are the most common types of wafer singulation?
The most common methods of wafer singulation are mechanical dicing are:
What determines the best method for wafer singulation of my wafer?
Material type, wafer thickness, and street width are the most critical factors in wafer singulation when determining the optimal process method.
What are some keys when considering street widths of my wafer and subsequent dicing?
The following are keys when considering street width:
I have a multi-project wafer, what are some considerations?
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