Position Summary:
The Wire Bond Operator runs automatic or manual bonding machines that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads.

Key Responsibilities:

  • Visual inspection.
  • Set-up and operate all wire bond machines with aluminum and gold ball.
  • Performs capillary change.
  • Operates a variety of equipment, including high-powered microscopes, with speed an accuracy.
  • Follows Job Traveler instructions accurately.
  • Identifies and reports process deviations to Supervisor.
  • Ability to meet quality goals, safety requirements, and follow company policies.
  • Ability to mulit-task.
  • Flexible to perform other duties as assigned.

Desired Knowledge:

  • Experience with wire pull machines and wedge bonders (K&S 1472)
  • Experience with ball bonders (ASM Eagle 60, ASM Extreme and K&S ICONN Plus)
  • Experience with H&K Wedge Bonder, Setup/Recall Program wedge and ball bonders.


  • High school diploma or equivalent required.
  • 6 months experience in Quality Inspection or micro-electronic Production environment preferred.


  • Minimum of two years’ experience in a manufacturing environment.
  • Minimum of two years’ experience working in class 10k clean room.

Physical Demands and Work Environment
This is a light manufacturing position that requires extended periods of standing and walking in a clean-room environment.  Must be able to lift five (11-25) pounds. Overtime required in accordance with company needs.


Please submit cover letter, resume, and job application to:

Integra Technologies LLC
Attn: Human Resources
1635 McCarthy Blvd
Milpitas, CA 95035
email: integrajobs@integra-tech.com

Fax: (408) 321-6407