integra-wafer-thinningIntegra specializes in ultra-thin precision wafer thinning and polishing down to 25µm. Integra routinely handles bumped wafers of wide-ranging bump heights and pitches and stocks a diverse assortment of front side tapes to provide the best protection for your wafers during processing.

Wafer grinding can create significant subsurface damage which can cause wafer damage when grinding is used to make wafers very thin, e.g. <100µm. Integra's dry polishing service removes much of the subsurface damage to enable safer die handling and yields.

Materials processed include Silicon, Gallium Arsenide (GaAs), Sapphire, Quartz, Silicon Germanium (SiGe), Laminates, Piezoelectric, and Glass.