Tutorial: Flip Chip Package Technology

Flip Chip package technology offers a range of benefits including high pin count, high signal density, better power dissipation, low signal inductance, and good power/ground connectivity, and is ideal for high speed interfaces (including RF) that wire bonds cannot support.

In this interactive tutorial you will learn more about:

  • Flip Chip Benefits
  • Industries where used
  • Bumping and RDL
  • Substrate
  • Implementations and Test
  • Qualification Considerations

Download the notes below from April 14th tutorial, or contact us with any questions: TechnicalHotline@integra-tech.com

 

Flip Chip Technology Tutorial Notes