integra-pick-placePICK & PLACE

Integra Technologies's Die Preparation Services include:

  • Automatic Pick & Place is available to place dice in:
    • Waffle Packs
    • Tape and Reel (paper of Surf tape)
    • GelPack
  • Manual Pick & Place is available for:
    • Die-sensitive
    • Topside handling
    • Unpassivated
    • MEMs
    • Ultra-clean processing of optical or image chips
    • Die picking from wafer maps

Individual die I.D. recording is available