PICK & PLACE
Integra Technologies's Die Preparation Services include:
- Automatic Pick & Place is available to place dice in:
- Waffle Packs
- Tape and Reel (paper of Surf tape)
- GelPack
- Manual Pick & Place is available for:
- Die-sensitive
- Topside handling
- Unpassivated
- MEMs
- Ultra-clean processing of optical or image chips
- Die picking from wafer maps
Individual die I.D. recording is available