PICK & PLACE

Integra Technologies's Die Preparation Services include:

• Automatic Pick & Place is available to place dice in:
  • Waffle Packs
  • Tape and Reel (paper of Surf tape)
  • GelPack
• Manual Pick & Place is available for:
  • Die-sensitive
  • Topside handling
  • Unpassivated
  • MEMs
  • Ultra-clean processing of optical or image chips
  • Die picking from wafer maps