INTERCONNECT

Interconnect plays an important role in determining the speed and reliability of your product. At Integra, we offer a variety of processes for Aluminum and Gold wire bonding including ultra-fine pitch bonding and the latest in flip chip technology.

• Flip Chip product capabilities include:
  
  • Flip Chip in package (FCIP) such as FCBGA and Flip Chip on board (FCOB)
  • Organic laminates or ceramic substrates
  • Single or multiple Flip Chip and wire-bonded IC's in hybrids or multi-chip modules
  • Bonding of solder bumped dice to substrates with an accuracy as tight as 5 microns
  • Solder joints are reflowed in nitrogen under tight temperature control and reflow profiles are available for eutectic and also for lead-free solder
  • Gold stud bumping
  • Studded die can be thermosonically joined to customer substrates, or soldered using a gold tolerant solder
• Wire Bonding capabilities include:
  • Ultra-Fine Pitch bonding
  • Gold Ball Bond 
  • Gold Wedge 
  • Aluminum Wedge Bonds