integra-encapsulationENCAPSULATION

The type of material and method of attachment used to encapsulate a device can be critical in determining the completed package class. At Integra, we offer a large variety of encapsulation options to meet all our customers’ requirements.  

  • Transfer Mold
  • Glob-Top / Dam & Fill
  • Lid Options:
    • Ceramic
    • Glass
    • Metal
    • Plastic
  • Lid Seal Options:
    • Epoxy
    • Glass Frit (hermetic)
    • Solder (hermetic)