ENCAPSULATION

The type of material and method of attachment used to encapsulate a device can be critical in determining the completed package class. At Integra, we offer a large variety of encapsulation options to meet all our customers’ requirements.  

• Transfer Mold
• Glob-Top / Dam & Fill
• Lid Options:
  • Ceramic
  • Glass
  • Metal
  • Plastic
• Lid Seal Options:
  • Epoxy
  • Glass Frit (hermetic)
  • Solder (hermetic)