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OPEN HOUSE - June 19th!

Posted by Susan Campbell on Wed, Jun 06, 2018 @ 08:41 AM

Join us for an Open House at our Milpitas, CA facility Tuesday, June 19th! The Open House includes facility tours, wine tasting and hors d'oeuvres. View first hand Integra's ability to take your project from start to finish with their wafer processing and testing equipment all under one roof!

RSVP today! info.sv@integra-tech.com

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Case Study: GaN Wafer Dicing

Posted by Jonny Corrao on Wed, May 30, 2018 @ 02:34 PM

CHALLENGE:
To develop a singulation process for GaN wafers that consistently provides high quality and yields.

CASE STUDY:
GaN-scribe-breakIntegra evaluated the quality of die singulation of mechanical dicing versus scribe and break. A 120µm thick 4" GaN wafer was used for the evaluation.

SOLUTION:

  • Mechanical dicing exhibited superior topside and backside quality compared to scribe and break.
  • The mechanical dicing cut was very clean on the topside of the die with none of the chipping issues that one might normally expect from a hard III-V material.
  • Backside quality from mechanical dicing was acceptable per Mil-Std specifications.
  • Scribe and break demonstrated inferior topside quality compared to mechanical dicing due to the inability to maintain consistent and sufficient force during scribing of the GaN material.
  • Backside quality was also substandard compared to mechanical dicing due to the excessive force required to break and separate the hard III-V material. 

RESULT:
As a result of this evaluation, Integra was able to develop and qualify a high-quality production process for singulating GaN wafers using mechanical dicing.

Interested in finding out more or have your own challenge for Integra to solve?

Let us know!

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Visit Us at ICSCRM This Week in Washington DC!

Posted by Susan Campbell on Mon, Sep 18, 2017 @ 03:41 PM

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Attending ICSCRM?

Stop by Booth #318 and say 'HI' to Mustafa and Stephen

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