Integra Technologies is OPEN
Join us for an Open House at our Milpitas, CA facility Tuesday, June 19th! The Open House includes facility tours, wine tasting and hors d'oeuvres. View first hand Integra's ability to take your project from start to finish with their wafer processing and testing equipment all under one roof!
RSVP today! firstname.lastname@example.org
To develop a singulation process for GaN wafers that consistently provides high quality and yields.
Integra evaluated the quality of die singulation of mechanical dicing versus scribe and break. A 120µm thick 4" GaN wafer was used for the evaluation.
As a result of this evaluation, Integra was able to develop and qualify a high-quality production process for singulating GaN wafers using mechanical dicing.
Interested in finding out more or have your own challenge for Integra to solve?
Let us know!