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Dice Before Grind (DBG) for Medical Devices

Posted by Jonny Corrao on Thu, May 12, 2016 @ 12:11 PM

CORWIL was recently approached by a medical customer who had developed a tiny wearable device that included a small bare die with innovative packaging. The product required a very small and strong die due to the customer’s very tight and unconventional package requirements. The die were on a 300mm wafer and had tight streets and low-k dialectrics.

Knowing that the backside and edge quality were key, the CORWIL team used Dice Before Grind (DBG) to reduce die breakage and chipping typically caused by the conventional method. DBG reverses the usual process of fully dicing the wafer after grinding. In DBG, the wafer is first trenched, or partial-cut, to a depth greater than the final target thickness. The wafer is then thinned to the final target resulting in die separation. After grind, the wafer goes to the in-line DBG Mounter, which mounts the wafer and gently peels off the protective grinding tape, completing the process.

Since the die are singulated at the final target thickness, wafer-level breakage is greatly reduced. Additionally, as a result of the die separation occurring during the grinding process, the backside chipping associated with thin-wafer dicing is kept to a minimum. DBG can also provide improved die strength depending on the application. For these reasons, DBG is an excellent process for processing wafers with high-quality backside requirements.

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CORWIL Technology Receives Quality Management System

Posted by Susan Campbell on Wed, May 06, 2015 @ 06:43 AM
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Milpitas, CA, May 6, 2015 - CORWIL Technology announced today their Certification to the Aerospace Quality Management System, AS9100C, after a comprehensive audit by the international certification body NSF-ISR (NSF International Strategic Registrations). This major milestone demonstrates CORWIL’s commitment to the highest standards for contract management of assembly, test and reliability services.

"This achievement allows our customers to contract with CORWIL with the utmost assurance of device test accuracy, workmanship and reliability. We continue to fulfill our customers’ requirements by providing three quality management systems certifications: ISO 9001:2008 (management systems), ISO 13485 (medical devices), and AS9100C (aerospace systems) that meet government, regulatory, military, and space communities needs in particular,” said Dhiraj Bora, CORWIL’s Vice President of Sales and Marketing.

“CORWIL continues to offer its customers the benefits of combined engineering services, assembly, testing, reliability and operational processes. This certification is an outstanding achievement in our portfolio of offerings,” added Matt Bergeron, CORWIL President and CEO.

CORWIL achieved the AS9100C certification in conjunction with continual certification to ISO 9001:2008 and ISO 13485, with upgrades to include testing, burn-in, environmental testing, reliability, end-of-line and tape & reel services.

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Die-Prep Considerations for IC Device Applications

Posted by Susan Campbell on Wed, Oct 29, 2014 @ 07:16 AM

MEPTECEarlier this month, CORWIL's own Jonny Corrao, Engineering Manager, presented 'Die-Prep Considerations for IC Device Applications,' at the October MEPTEC Luncheon at the Biltmore Hotel in Santa Clara, CA.

Thank you for coming for all of those who attended. If you weren't able to make the luncheon please download the presentation below.

Die-Prep Considerations for IC Device Applications (.pdf)

  • Final thickness, surface finish, edge & backside quality, application demands… one wafer, yet endless combinations of process options when working to achieve the highest quality dice possible, prior to IC assembly. This presentation explores various device applications, with consideration to technology node, wafer size, wafer material(s), interconnect, reliability criteria, packing method, and assembly requirements, in concert with die-prep disciplines spanning wafer thinning, singulation, die-sort (pick & place or “plating”), and inspection methods.

Please contact CORWIL with any question you have regarding the presentation or any of CORWIL's services - info@corwil.com