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BGA's with Tin Lead Solder Balls

Posted by Susan Campbell on Tue, Nov 05, 2019 @ 09:35 AM

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No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities

  • bga-tin-lead2We offer open-tooling (JEDEC Standards) CSBGA (CSBGA (CHIP SCALE BGA) at our Milpitas, Calif facility
    • Body sizes: Virtually Unlimited
    • Mold caps: 0.60, 0.80, 1.0 1.25mm
    • Total profiles vary by substrate
    • Ball pitch: 0.40mm & Larger
  • We attach the tin/lead solder during the assembly process on our BGA packages. No re-balling or re-work needed; one reflow process
  • Meets the requirements for Commercial, Industrial, Medical and Aerospace customers
  • If custom BGA package is required, please contact us. We will tool custom plastic BGAs with reasonable development NREs

Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.

Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley

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Integra is at IMAPS Boston NOW!

Posted by Susan Campbell on Wed, Oct 02, 2019 @ 09:35 AM

imaps-boston-2019Stop by booth #401 at IMAPS Boston today and tomorrow and say Hi to John and Richard.

They are eager to discuss Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Visit Us at the IMAPS Advanced System in Package Technology Conference and Exhibition June 25-27

Posted by Susan Campbell on Thu, Jun 20, 2019 @ 10:42 AM
 

Integra's System-in-Package & MCM solutions offer the capabilities of a complete system in one device. As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. Our SiP solutions can help product developers achieve next-generation performance levels. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power (SWaP) that are critical to next-generation performance in defense and medical applications.

Stop by the IMAPS Advanced System in Package (SiP) Technology Conference and Exhibition, Tues-Thurs, June 25-27 and talk to us more on how we can help with your SiP needs! 

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