Integra Technologies is OPEN
Integra has been an indispensable part of Saluda Medical’s growth and ongoing successes towards commercialization of the Evoke® ECAP-Controlled Closed-Loop spinal cord stimulation system.
Find out how Integra has worked with Saluda to overcome the challenges of bringing a medical product to market.
No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities
Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.
Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley
They are eager to discuss Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.