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Expanded RF Services from Integra

Posted by Susan Campbell on Tue, May 05, 2020 @ 10:06 AM

Whatever your specific RF requirements, Integra can help.

rf-testing-integra-technologiesFor over 35 years, Integra has been an integral part of our customers semiconductor testing. We are a valued partner to defense contractors, telecommunications manufacturers, medical instrumentation companies and more. RF testing is only one aspect of our capabilities — with multiple locations, we can determine the set of processes that’s right for your business and expedite testing to help you get your product to market faster.

RF Testing:

  • Multiple(6) 4 port, 50 GHz PNA systems with various options
  • Trained operator staff for performing hand test or auto-handler  package test

RF Wafer Sort:

  • Multiple(7) Cascade Probe Stations, P12XLn and UF200AL auto probers
  • Experienced operator and support staff in using 
  • Pyramid probe cards, positioners and wedges for performing RF wafer sort.
  • Newly installed clean environment with room for up to 8 wafer sort cells.

Contact Integra Technologies

BGA's with Tin Lead Solder Balls

Posted by Susan Campbell on Tue, Nov 05, 2019 @ 09:35 AM

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No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities

  • bga-tin-lead2We offer open-tooling (JEDEC Standards) CSBGA (CSBGA (CHIP SCALE BGA) at our Milpitas, Calif facility
    • Body sizes: Virtually Unlimited
    • Mold caps: 0.60, 0.80, 1.0 1.25mm
    • Total profiles vary by substrate
    • Ball pitch: 0.40mm & Larger
  • We attach the tin/lead solder during the assembly process on our BGA packages. No re-balling or re-work needed; one reflow process
  • Meets the requirements for Commercial, Industrial, Medical and Aerospace customers
  • If custom BGA package is required, please contact us. We will tool custom plastic BGAs with reasonable development NREs

Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.

Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley

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