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Upcoming Webinars From Integra Technologies

Posted by Susan Campbell on Thu, Oct 01, 2020 @ 02:07 PM
Sign up now for one of Integra's Webinars coming up this month:
 
By request, Integra Technologies will be offering the
'Obsolescence Management for EEE Parts' Webinar AGAIN!
Thursday, October 22nd
11:00 a.m. PST
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Advanced Packaging Overview –
Design through Assembly and Test: FlipChip and SiP Packages
 
Thursday, October 22nd
1:00 p.m. PST 
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Have Questions?
 
Contact Integra Technologies

 


Miss one of our previous webinars? Download the notes today:

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Mil-Std-1580 DPA Including DPAs for Copper Bond Wire PEMs

Obsolescence Management for EEE Parts - Learn more about Integra's services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts

Testing of Complex FPGA's, Memory and Microprocessors - Integra has developed over 10,000 test programs including these complex devices. This webinar will explore the nuances of how such complex devices are tested.

Standards of PEM Qual and Technical Requirements Review - Integra is the leader in performing PEM (Plastic Encapsulated Microcircuits) screening, qualification and DPA for the Aerospace and Defense market.


VISIT US:

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Huntsville • Redstone Arsenal Small Business Contracting Conference & Expo
Wed, Oct 21, 2020, 7:00am - 4:00pm
Von Braun Convention Center, Huntsville, AL 35801
 
 

Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!

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Integra Technologies is OPEN

Posted by Susan Campbell on Tue, Apr 21, 2020 @ 09:14 AM

Integra Technologies is OPEN

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Visit Integra Technologies at DMSMS 2017, Booth #920

Posted by Susan Campbell on Mon, Nov 20, 2017 @ 09:12 PM

Integra Technologies provides a complete portfolio of turn-key services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts.  Whether it's Obsolescence Management, Cu Wire Bond Evaluation, PEM Quals, Die Preparation Services, Packaging, Die Extraction and Repackaging (DER), System in Package (SIP), Multi-Chip Modules,  Upscreening, Complex Device Testing, Destructive Physical Analysis (DPA), or Failure Analysis (FA), Integra has an industry leading solution.

PRESENTATION:

Joe Holt from Integra Technologies will be presenting:"Comprehensive Electrical Testing of Suspect Counterfeit Field Programmable Gate Arrays (FPGAs) Proven to Eliminate Counterfeit Devices not Caught by Conventional Mechanical Screening Protocols" during the "Counterfeit Field Forensics and Advanced Detection" training session on Monday, Dec. 4 from 10:30 to noon at the Tampa Convention Center / Rooms 11-17

Please stop by booth #920 and discuss your specific testing requirements with our team of experts.

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