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Dice Before Grind (DBG) for Medical Devices

Posted by Jonny Corrao on Thu, May 12, 2016 @ 12:11 PM

CORWIL was recently approached by a medical customer who had developed a tiny wearable device that included a small bare die with innovative packaging. The product required a very small and strong die due to the customer’s very tight and unconventional package requirements. The die were on a 300mm wafer and had tight streets and low-k dialectrics.

Knowing that the backside and edge quality were key, the CORWIL team used Dice Before Grind (DBG) to reduce die breakage and chipping typically caused by the conventional method. DBG reverses the usual process of fully dicing the wafer after grinding. In DBG, the wafer is first trenched, or partial-cut, to a depth greater than the final target thickness. The wafer is then thinned to the final target resulting in die separation. After grind, the wafer goes to the in-line DBG Mounter, which mounts the wafer and gently peels off the protective grinding tape, completing the process.

Since the die are singulated at the final target thickness, wafer-level breakage is greatly reduced. Additionally, as a result of the die separation occurring during the grinding process, the backside chipping associated with thin-wafer dicing is kept to a minimum. DBG can also provide improved die strength depending on the application. For these reasons, DBG is an excellent process for processing wafers with high-quality backside requirements.

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CORWIL Technology Receives Quality Management System

Posted by Susan Campbell on Wed, May 06, 2015 @ 06:43 AM
corwil-iso-certification

Milpitas, CA, May 6, 2015 - CORWIL Technology announced today their Certification to the Aerospace Quality Management System, AS9100C, after a comprehensive audit by the international certification body NSF-ISR (NSF International Strategic Registrations). This major milestone demonstrates CORWIL’s commitment to the highest standards for contract management of assembly, test and reliability services.

"This achievement allows our customers to contract with CORWIL with the utmost assurance of device test accuracy, workmanship and reliability. We continue to fulfill our customers’ requirements by providing three quality management systems certifications: ISO 9001:2008 (management systems), ISO 13485 (medical devices), and AS9100C (aerospace systems) that meet government, regulatory, military, and space communities needs in particular,” said Dhiraj Bora, CORWIL’s Vice President of Sales and Marketing.

“CORWIL continues to offer its customers the benefits of combined engineering services, assembly, testing, reliability and operational processes. This certification is an outstanding achievement in our portfolio of offerings,” added Matt Bergeron, CORWIL President and CEO.

CORWIL achieved the AS9100C certification in conjunction with continual certification to ISO 9001:2008 and ISO 13485, with upgrades to include testing, burn-in, environmental testing, reliability, end-of-line and tape & reel services.

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CORWIL Increases Die Attach Capacity with a New MAT 6400

Posted by Susan Campbell on Mon, Mar 31, 2014 @ 07:50 AM

Milpitas, CA, March 31, 2014 – CORWIL Technology (CORWIL) announces continued invest ment in capabilities with the addition of a new MAT 6400 for automated die attach.

MAT 6400Improving quality and reliability is a basic tenet of CORWIL Technology’s focus on superior customer service and meeting today’s exacting quality demands in assembly. To this end CORWIL has added a new MAT 6400 die attach system from MicroAssembly Technologies. This equipment acquisition adds capability and improves quality in the assembly operations.

Die attach is the foundation of the assembly process; it is the first critical step in the
process and getting it right is essential for a reliable finished product. The MAT 6400 die attach system helps achieve the goal of a solid foundation by using a high resolution digital vision system to ensure a pick and placement accuracy of 3 um @ 3 sigma (Application dependent). The fully automated system is designed for flexibility and improved quality.

The MAT 6400’s handling equipment can pick die from a variety of sources including waffle/Gelpacks, tape and reel feeders giving customers flexibility in their sourcing options.  The flexible tooling allows CORWIL to process active and passive components in sizes ranging from 0.2mm to 25mm. In addition the tooling is capable of handling unusual die sizes and aspect ratios associated with CCD’s, sensors and sensitive MEMS devices and ensure accurate BLT (Bond Line Thickness) control.

A number of die attach methods are available including:

  • Epoxy or Silver Glass
  • Eutectic
  • Thermo-compression

Features include:

  • The flexibility of the adhesive dispensing system allows single and multi dot patterns to be applied from a library of dispense patterns or the
    development of custom patterns for a specific project/customer application. The pin transfer process, stamping, has the capability of applying adhesive dots 75 micron and under.
  • Flip chip processing is easily handled with inline bump fluxing as well as over and up looking cameras to ensure accurate chip placement and alignment.
  • Heating of the substrate and tools are available to ensure the quality of the eutectic and thermo compression bonding processes.
  • Die stacking is another advanced feature of this equipment.

Richard Tung, CORWIL’s VP of Operations added “The MAT 6400 increases our capabilities in the handling of die from a variety of sources and the processing of thin and/or fragile die and devices including MEM’s LCD’s and sensors. The different die attach methods allow us to offer customers a variety solutions to meet their quality and delivery needs for prototype or production volumes in a timely fashion.”

“The integration of this capability, coupled with other recent equipment additions, adds to our
flexibility, accuracy and increased capacity and through put,” stated Matt Bergeron, CORWIL Technology’s President and CEO. “This capital investment continues our commitment to build CORWIL’s capabilities to service the Mil/Aero and medical customers who demand a secure, on-shore, fully qualified and certified facility for processing and handling of their die. The increased capacity is a demonstration of our commitment to be the leading independent assembly and test facility for all our customers.”

 

About CORWIL Technology Corporation

CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies.

For more information about CORWIL, please visit www.corwil.com.