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-55°C Electrical Testing from Integra

Posted by Susan Campbell on Wed, Sep 26, 2018 @ 09:32 AM

thermostream1Integra Technologies uses its advanced automated test equipment (ATE) for the purpose of testing at -55°C and beyond. In support of extended temperature testing, we have 35+ ATEs to support the test program development and testing of EEE components. Our successful track record for software development and electrical testing is largely due to:

  • Extensive experience in characterizing  and testing  EEE devices at -55°C and below. This includes Discrete, Passives, Linear, Memory, FPGA, SERDES, Microcontrollers, A/D, D/A, Connectors, Relays, Inductors and Magnetics.
  • Utilizing the largest on-site Test Engineering team, among all test labs worldwide, to develop software and hardware for the extended temperature testing and characterization
  • Integra’s -55°C test strategy includes using one of  our many precision ‘Thermal Temperature Forcing’ units in conjunction with our advanced ATEs. Our  temperature forcing units are testing from -75°C to +200°C.
  • Our custom DUT (Device Under Test)  temperature monitoring process includes
    • Continuous monitoring of temperature at the DUT level for compliance to maintain the target temperature. 
    • Temperature guard-band to account for temperature gradient across the measurement area
    • Calculated temperature ramp rates and soak times to achieve junction temperatureequilibrium using actual packaged devices
    • Precision temperature monitoring thermocouples used to insure highest integrity of test temperature assurance to specification
    • Controlled anti-ESD environment within the Thermal Temperature Forcing units
  • Our cold temperature process has been audited by DLA for compliance
  • High volume cold temperature testing using cold temperature handlers
  • We test both packaged and wafer level cold temperature testing
  • Thousands of lots of historical data running -55°C testing
  • Extensive work with cold temperature storage or cold temperature life test followed by cold temperature electrical testing

 Interested in Learning More? Contact Integra Today!

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Your Single Source Turnkey Solution, from Wafer Processing to Final Test with our Locations Throughout the U.S.!

Open House TODAY!

Posted by Susan Campbell on Tue, Jun 19, 2018 @ 12:09 PM

Stop by and say 'hello' to the Integra group - facility tour, food and drinks! 3:00-7:00 p.m.!

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Visit Integra Technologies at DMSMS 2017, Booth #920

Posted by Susan Campbell on Mon, Nov 20, 2017 @ 09:12 PM

Integra Technologies provides a complete portfolio of turn-key services to support Military/Space/Aerospace companies threatened with diminishing sources of supply for semiconductor and related EEE parts.  Whether it's Obsolescence Management, Cu Wire Bond Evaluation, PEM Quals, Die Preparation Services, Packaging, Die Extraction and Repackaging (DER), System in Package (SIP), Multi-Chip Modules,  Upscreening, Complex Device Testing, Destructive Physical Analysis (DPA), or Failure Analysis (FA), Integra has an industry leading solution.

PRESENTATION:

Joe Holt from Integra Technologies will be presenting:"Comprehensive Electrical Testing of Suspect Counterfeit Field Programmable Gate Arrays (FPGAs) Proven to Eliminate Counterfeit Devices not Caught by Conventional Mechanical Screening Protocols" during the "Counterfeit Field Forensics and Advanced Detection" training session on Monday, Dec. 4 from 10:30 to noon at the Tampa Convention Center / Rooms 11-17

Please stop by booth #920 and discuss your specific testing requirements with our team of experts.

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