Susan Campbell

Recent Posts

Construction Analysis from Integra Technologies

Posted by Susan Campbell on Wed, Apr 08, 2020 @ 09:43 AM

Construction Analysis from Integra Technologies


Construction Analysis gives a detailed view of the construction quality and materials used during the manufacturing of electronic components. Integra provides services to perform non-destructive and destructive Construction Analysis (CA) tests appropriate for the product type for EEE devices.

Integra finds that before a part selection is made for usage in High Reliability application within Aerospace and Defense usage; it is a best practice to understand the construction of the device from both an assembly and fabrication perspective.


Construction Analysis provides:

  • Evaluation of the inherent design and robustness of the component
  • Examines and document the physical characteristics including-
    • Material elemental composition
    • Dimensions and quality of the assembly


Integra Partners with Presto Engineering

Posted by Susan Campbell on Tue, Mar 03, 2020 @ 08:57 AM



March 3, 2020 – WICHITA, Kan. – Integra Technologies, a global provider of semiconductor services for high reliability applications, announced today a partnership with Presto Engineering’s, San Jose, Calif.-based hub, a provider of test and qualification services to the radio frequency (RF) market in the U.S. READ MORE

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IMAPS - Device PackagingMarch 2-5, Fountain Hills, AZ

GOMACTech 2020, March 16-19, San Diego, CA Booth #213


24th Annual Components for Military & Space Electronics Conference & Exhibition, April 21-23, 2020

Die Prep Services from Integra

Posted by Susan Campbell on Wed, Feb 19, 2020 @ 09:09 AM

integra-die-prepDIE PREP SERVICES

Integra Technologies Silicon Valley, previously CORWIL Technologies, specializes in ultra-thin precision wafer thinning and polishing down to 25µm. 

Our Services include:

  • Wafer Thinning & Polishing
  • Wafer Dicing
  • Die Pick & Place
  • Die Inspection
  • All processes capable up to 300mm wafers

Integra has the most saw capacity of any North American subcontract manufacturer and can process virtually any material, including Silicon, Gallium Arsenide (GaAs), Indium Phosphide (InP), Sapphire, Quartz, Silicon Germanium (SiGe), Laminates, Piezoelectric, and Glass. 

Integra’s automated pick and place equipment allows for high volume processing of die into tape & reel and waffle pack and our inspection services can inspect die and wafers to Commercial, Military, Medical, and Space level specifications

Just One of Integra's Many Services.

Contact Us Today!

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Your Single Source Turnkey Solution, from Wafer Processing to Final Test with Locations Throughout the U.S.!

Case Study: Saluda Medical

Posted by Susan Campbell on Wed, Feb 05, 2020 @ 08:15 AM


integra-technologies-saluda-medicalIntegra has been an indispensable part of Saluda Medical’s growth and ongoing successes towards commercialization of the Evoke® ECAP-Controlled Closed-Loop spinal cord stimulation system.

Find out how Integra has worked with Saluda to overcome the challenges of bringing a medical product to market.

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Happy Holidays from Integra Technologies

Posted by Susan Campbell on Thu, Dec 19, 2019 @ 04:28 PM



ISTFA - Portland, Going on Now!

Posted by Susan Campbell on Wed, Nov 13, 2019 @ 12:58 PM

Integra-ISTFA-2019Stop by Booth #203 at ISTFA at the Portland Convention Center today and tomorrow to say 'Hi' to Sultan and Mark! Let them help you with your Failure analysis and Analytical Service Needs!

Not able to make the show? Contact our sales group today They are looking forward to hearing from you.

BGA's with Tin Lead Solder Balls

Posted by Susan Campbell on Tue, Nov 05, 2019 @ 09:35 AM


No Re-Balling Required with Integra’s On-shore Plastic BGA Assembly Capabilities

  • bga-tin-lead2We offer open-tooling (JEDEC Standards) CSBGA (CSBGA (CHIP SCALE BGA) at our Milpitas, Calif facility
    • Body sizes: Virtually Unlimited
    • Mold caps: 0.60, 0.80, 1.0 1.25mm
    • Total profiles vary by substrate
    • Ball pitch: 0.40mm & Larger
  • We attach the tin/lead solder during the assembly process on our BGA packages. No re-balling or re-work needed; one reflow process
  • Meets the requirements for Commercial, Industrial, Medical and Aerospace customers
  • If custom BGA package is required, please contact us. We will tool custom plastic BGAs with reasonable development NREs

Our engineering team works with customers to help identify and solve existing and potential IC packaging issues, sparing customers from costly packaging delays and potential failures due to rework. We will develop manufacturable package solutions for next-generation, high-volume production. Integra Technologies has the experience to meet your most demanding advanced packaging challenges including SiP, MCM, RF Modules and Stacked assemblies.

Tin/Lead Solder Balls for your BGAs from the get-go; look no further than Integra Technologies, Silicon Valley


Integra is at IMAPS Boston NOW!

Posted by Susan Campbell on Wed, Oct 02, 2019 @ 09:35 AM

imaps-boston-2019Stop by booth #401 at IMAPS Boston today and tomorrow and say Hi to John and Richard.

They are eager to discuss Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Integra Technologies at IMAPS Today!

Posted by Susan Campbell on Tue, Oct 01, 2019 @ 08:21 AM

Visit Integra Technologies September 30 - October 3 - Boston, MA - Booth #401

As a high-performance IC packaging provider, Integra Technologies can design, assemble and test custom System-in-Package (SiP) devices. By combining the functionality of a complete system into one packaged device, a SiP solution offers reductions in size, weight and power that are critical to next-generation performance in Aerospace, Industrial and Medical applications. In addition, a SiP solution reduces interconnect and trace lengths, minimizing the impact of parasitic and improving overall electrical performance.

Integra Technologies' capabilities in manufacturing multi-chip devices, surface mount assemblies, and flip chip and wire bond interconnects, enable the development of complete system-in-package solutions to improve performance and reduce footprint.

Stop by the booth today and say Hello to the Integra Team!

IMAPS Advanced System and Technology Conference Follow Up

Posted by Susan Campbell on Mon, Jul 01, 2019 @ 10:18 AM

Thank you to all who visited us last week at the IMAPS Advanced System and Technology Conference. It was a great turn out and we enjoyed speaking with you all. Please let us know if you have any questions or projects to discuss with our sales team. We look forward to hearing from you!

IMAPS 2019    kirk-imaps2019