Integra is an industry leader in performing Plastic Encapsulated Microcircuit (PEM) qualifications for Integrated Circuits (ICs) with over 800 lots processed to date (data available upon request). With increased usage of Copper and Silver bond wires in PEMs, a new Laser Ablation decapping technique has been developed that allows for device decapsulation with little or no acid attack.

Integra Technologies Analytical Solution's organization in Albuquerque, NM has installed the Control Laser Corporation FALIT (pronounced "F-A-Light") Laser Ablation system for cleaner plastic device decapsulation. 
This laser ablation decapsulation process uses a combination of laser and acid decapsulation. This is the preferred method of decapsulation for Copper and Silver bond wire products.
The Integra Laser Ablation process is a faster and more accurate decapsulation process that is less likely to damage bond wires. It will:
  • Cleanly remove mold compound using laser technology rather than traditional acid processes.
  • Expose wire bonds without damage to other components.
Data is available to compare and contrast the Integra laser ablation/chemical decapsulation with full chemical decapsulation. Our data shows:
  • Laser/Chemical De-encapsulation is repeatable.
  • Laser/chemical process results in tighter distribution.
  • Average and maximum breaking force was similar for both acid only and laser ablation/chemical but minimum breaking force was higher when laser/chemical process was used.
  • Bond pull strengths above the 2X limit of gold bond wires.
  • Cleaner opening with less damage to bond pads, lead frames and overall wire bonds.

Contact Us

Integra Technologies - Wichita
Semiconductor Development & Test Services 

3450 N. Rock Road, Building #100
Wichita, KS USA 67226 

Sales: (800) 622-2382

Main#: (316) 630-6800
Fax: (316) 630-6877


Analytical Solutions - Albuquerque
DPA & FA Services

10401 Research Rd. SE,
Albuquerque NM, 87123

Sales - (800) 622-2382

Technical Support - (505) 299-1967
Fax: (505) 292-0225 


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