WAFER PROBE

 Wafer Probe Data Sheet

Integra has the engineering talent, equipment and processes in place to support all probe services, including software development, probe card design / fab, debug and production probing.

We are a one stop shop for all your probe card design, fabrication, verification and production needs.

Experience with all probe card technologies including:

• Cantilever:  1- 8 sites up to 800 probes
• Vertical: Multi site
• Membrane: Multi site
• RF: Coax, Membrane and Custom solutions
• Elevated probing up to 135°C and custom probing up to 180°C

Probe Data Analysis throughout your startup and ongoing production probe:

• Wafer Map Conversion
• Retest of defined bins without full wafer reprobe
• Custom mapping for inkless assembly
  • Onsite custom format solutions for inkless assembly
  • Assembly back to production map conversion
  • Wafer inspection map conversion to electrical test  maps
• Wafer Analysis
  • Composite Mapping
  • Multi site comparison
  • Integration to Galaxy^® software

For more information on our Test Services, please contact an Integra Sales Office or fill out a Request for Additional Information.

Summary of Probe Capabilities:

• 3" to 12” capability
• Probe card design, fab and verification
• Bumped probe
• Al, Au pads and Pb, Pb free bumps
• High Z force chuck
• High pin count, fine pitch
• Multi site
• Vertical, Cantilever & Membrane probe
• RF probe (Membrane, Coax or custom solutions)
• N2 and vacuum wafer storage
• Elevated probing up to 180 °C
• Data analysis capability
• High volume production probe
• Handle wafers back grind to 6 mils