Semiconductor Electrical Testing Services, Wafer Probe
We provide full test engineering development service, IC qualification, IC and semiconductor authenticity verification, reliability analysis, tape & reel and technology transfer. Whether you need just one of our world-class services or full turnkey capability, Integra Technologies wants to be a partner in your success.
Test Software and Hardware Development & Engineering Support
- RF, Logic, Linear, Mixed Signal, Analog, Digital, Memory - Supporting ALL package styles
- Electrical Characterization Testing (Hot and Cold Temp)
- Test Software Conversions
- Hardware Development and Equipment Selection
Counterfeit IC & Semiconductor Authenticity Testing
Package Test & Wafer Probe
- Ambient, Hot & Cold Temperature Testing
- Commercial, Military, Space, Automotive & Telecom Device Testing
- Custom Test Processing - Commercial to Military Temps / Flow
- COTS Upscreening (-55°C to 125°C)
Reliability Stress Testing
- HTOL, LTOL, HAST, T/C, THB testing, IR Pre-Conditioning, Latch-Up & ESD testing
- Automated ESD Sensitivity Classification & Latch-Up Testing (1024 Pin):
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Human Body Model (HBM) per JEDEC, ESDA, Mil-Std-883, AEC and Lucent standards
- Machine Model (MM) per JEDEC, ESDA and AEC standards
- Charged Device Model (CDM) per JEDEC, ESDA, AEC and Lucent standards
- Characterize all pins, establish ESD sensitivities and failure threshold
- Military Classifications: Per MIL-STD 883, Method 3015
- PEM Quals for OEMs (Military, Space, Telecom, Auto)
- Characterization / Analysis: Graphically monitor leakage changes
- Latch-up per JEDEC 17 & 78; custom; elevated temperature to 150°C
Full Service Processing
- Tape & Reel, Lead Scanning, Bake & Dry Pack, Drop Ship
Extensive High Speed Digital & Mixed Signal Engineering Expertise
- Development Experience with Complex Devices:
- Microprocessors / DSP / Microcontroller / Graphic Engines
- Communications (Ethernet, DSL, Base Band, Networking)
- Consumer (Games, Digital Audio, Digital TV, Set Top Box)
- System-On-a-Chip (SOC) / High Performance ASIC and ASSP
- Digital Test Development Capabilities:
- Simulation to Test Vector Conversion
- >600 pins @ >600Mhz, ± 125ps
- Algorithmic Memory Test
- Pattern Depth 28Meg & SCAN (>128M)
- Emphasis on Multi-site
- Mixed Signal Capabilities:
- Audio to 20 bits, Video to 60 MHz
- TIF to 600 MHz, RF to 6 GHz
- Time & Jitter Digitizer
General Purpose Mixed Signal Test Expertise
- Experience with all Linear types:
- DAC & ADC
- Switches & Multiplexers
- Discrete & Arrays
- OpAmps & Comparitors
- Interface
- Custom On Board Circuitry:
- Low Leakage
- Feedback loops
- High Accuracy
- Semi-Manufacturer Development
- Emphasis on Strip Testing
- Product Engineering and Qualification
Memory Test Expertise
- Extensive Pattern Library:
- Quiet Pattern Testing
- 74xxx, 16/32-bit, ECL
- High Speed/Accuracy Testing:
- Golden Device Routines
- Bench Calibration Techniques
- Semi-Manufacturer Involvement
- Product Engineering and Qualification
RF Test
- Established Reputation for RF IC testing
- Test Development Centers:
- 6 GHz capability
- Experienced engineering staff
- Complete Test Integration Engineering
- Provide contactor interface
- Handler integration
- Internal RF Hardware / Board design
- Qualification and Characterization Services
- World-Wide Production Processing & Support
Test Platform Conversions
- Transfer a device running on a test system to a newer test system:
- Test system may now be obsolete
- Moving a product line to offshore
- Old platform is too slow, too old or just not capable enough
- Services offered:
- Pattern and program conversions
- Correlation analysis
- New hardware design and interface
- Hardware conversion verification
- Integra has converted hundreds of test programs from older, slower systems to newer and more capable equipment
Other Services
- Parts Procurement
- Test time rental
For more information on our semiconductor test services, please contact an Integra Sales Office or fill out a Request for Additional Information.
| Description |
File Type |
File Size |
| Integra Technologies Semiconductor Test Data Sheet |
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142 kb
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